25.6-Tbps CPO Switch Product Highlights:
- 2RU system design with high efficiency air cooling to support 4x3.2-Tbps optical CPO interfaces routed to 16 MPO connectors and 32x400G electrical QSFP112 ports
- CPO engine to front-panel routing supports both traditional fiber and flexible printed fiber (FPF) solutions
- System design compatible to support multiple remote laser modules (RLM)
- More than 50% optical interconnect power consumption savings compared to standard pluggable optics solutions
- Production ready for data center deployment
The slowing of Moore’s Law coupled with the limitations of copper interconnect at high data rates has prompted the industry to rethink the architecture and deployment of high bandwidth network switches. Furthermore, next generation cloud infrastructure deployments require lower optics cost per bit and power consumption. Broad adoption of CPO solutions is critical to sustaining the rapid growth of bandwidth inside the data center driven by AI/ML, HPC, and networking workloads.
Traditional pluggable optical transceivers require high power to equalize signal impairments incurred on a signal as it traverses long traces and through multiple connector discontinuities in a standard switch system. By eliminating these interfaces and leveraging Broadcom’s leading-edge uncooled continuous wave (CW) laser at 1310 nm for silicon photonics, the 25.6-Tbps Humboldt CPO switch delivers unmatched efficiency and performance paving a path for future generations of high bandwidth density CPO solutions.
“We are pleased to announce our strategic partnership with Tencent as we enable the industry’s first 25.6-Tbps CPO system for hyperscale data center field deployment,” said Near Margalit, Vice President and General Manager, Optical Systems Division, Broadcom. “We expect to continue to innovate and extend our market leadership position with Tencent as we migrate to 51.2-Tbps switch CPOs and next generation 200G/lane PAM-4 applications.”
“Customer demands for higher bandwidth have pushed Tencent to perpetually scale our network,” said
“Addressing the general trend towards chip-scale optical interconnects versus traditional copper-based implementation, CPO technology combines microelectronics and optoelectronics on silicon-based platforms, which can carry more information and transmit longer distances,” said
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Source: Broadcom Inc.